The Relationship Between Psychological Distress and Academic Adjustment Among the Undergraduates: A Conceptual Paper. Borneo Engineering & Advanced Multidisciplinary International Journal, [S. l.], v. 2, n. Special Issue (TECHON 2023), p. 223–226, 2023. Disponível em: https://beam.pmu.edu.my/index.php/beam/article/view/82.. Acesso em: 5 jul. 2024.